Dicing Saw

Purpose Dicing Si and Glass
Specifications 1. Wafer size : ~4"
2. Wafer thickness : 600um
3. Blade : 40um (Si), 150um (Glass)
4. Cutting Speed : 5mm/s(Si), 2mm/s(Glass)
Option Ring Frame, Roller, Mylar Film
Model / Company DISCO DAD-321