Probe Station

Purpose Check faults of the device before packaging
Specifications 1. Wafer and substrate size : 1'' to 150mm diameter, single chips and fragments, packaged devices by means of special adapters
2. Stage: 155mm x 155mm travel range X/Y, 360 rotation range, 0-3mm contact stroke, 90mm horizontal load stoke
3. Chunk: diameter(100/125/150 mm), planarity ( 3)
Option  
Model / Company SUSS PM5-III / KARL SUSS DRESDEN GmbH