| Purpose |
Mask drawing and PR exposure |
| Specifications |
1. Photo mask size : ~5"
2. Wafer size : ~4"
3. Light source : UV laser (peak 405nm)
4. Write head : 4mm
5 . Minimum feature : 0.5зн |
| Option |
Operation PC |
| Model / Company |
DWL66 / Heidelberg Instrument |
